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Advanced engineering, manufacturing, and technology consulting, specializing in microelectronics.

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About Us

Our Story

Nonantum Technical Services provides senior-level technical consulting across the full product development and manufacturing lifecycle—from early-stage feasibility and architecture through manufacturing enablement and volume production ramp.


We bring deep expertise in both the microelectronics and electronics industries, with a niche focus on advanced 2.5D/3D semiconductor packaging design, bleeding-edge PCB and PCBA development, and design-for-excellence methodologies.


The company is led by Shawn Brown, a senior technology consultant with over 40 years of experience in electronic and semiconductor product development and manufacturing, including 15 years of entrepreneurial leadership in DSP-based voice processing systems. His background spans engineering, manufacturing operations, sales and marketing, and executive leadership as a company co-founder and CEO.


Our work is hands-on, engineering-driven, and focused on solving real-world technical and manufacturing challenges in advanced microelectronics and electronic hardware systems. We specialize in supporting early-stage startups and emerging technology companies.


If you have a product development challenge and need experienced technical guidance, contact us today.

Core Capabilities

Semiconductor Package Engineering

IC Substrate & Si Interposer Design - Process Knowledge

IC Substrate & Si Interposer Design - Process Knowledge

 

  • Leadframe, MCM, BGA, 2.5D and 3D packaging architectures
  • Advanced substrates and interposers
  • Integration strategies
  • Thermal, EMI, and mechanical considerations
  • Off-shore OSAT and substrate vendor introduction and qualification
  • Design workflow and process development

IC Substrate & Si Interposer Design - Process Knowledge

IC Substrate & Si Interposer Design - Process Knowledge

IC Substrate & Si Interposer Design - Process Knowledge

 

  • Substrate materials, technology stackups, and fabrication processes
  • Design, layout, CAM, and verification
  • Strip and panelization design
  • Die attach, wirebonding, and underfill
  • Paste mask, SMT pick and place
  • Overmolding, wafer and package singulation
  • Ultra-high bump count FC BGA and FC Cu pillar devices, Stacked dies

Early-Stage Product Development

IC Substrate & Si Interposer Design - Process Knowledge

Early-Stage Product Development

 

  • Technology feasibility, review, and design
  • Proof of concept, benchmarking, and prototyping
  • Manufacturability considerations
  • Bill-of-materials development
  • Strategic product planning
  • EDA workflow development
  • Engineering and manufacturing team development

PCB & PCBA Engineering

Microelectronics & PCBA Manufacturing DFx

Early-Stage Product Development

 

  • High-speed and high-density PCB design
  • Material selection and stackup design
  • Signal integrity and power integrity
  • Production-ready documentation
  • CAM and data review
  • Manufacturing and test handoff
  • RF and complex high-speed bus interface constraints

Microelectronics & PCBA Manufacturing DFx

Microelectronics & PCBA Manufacturing DFx

Microelectronics & PCBA Manufacturing DFx

 

  • Design for manufacturability (DFM) readiness
  • Design for assembly (DFA) readiness
  • Design for test (DFT) readiness
  • Yield and reliability optimization
  • Cost reduction review
  • Failure analysis (FA)

Mechanical & Product Design

Microelectronics & PCBA Manufacturing DFx

Microelectronics & PCBA Manufacturing DFx

 

  • 2D/3D mechanical and enclosure design
  • Environmental and structural considerations
  • Design for high-volume manufacturing
  • Cross-domain integration
  • Pre-certification review and test readiness
  • Product mockups
  • Tooling and fixture development

Technology Focus Areas

 

  • Mobile and wireless connectivity
  • Consumer products
  • Edge computing platforms
  • Voice and audio processing systems
  • Robotics and embedded hardware
  • Autonomous vehicle systems


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